Research Progresses on Reliability of Sn-based Solder Joints in Extreme Temperature Environment
نویسندگان
چکیده
منابع مشابه
Low-Cycle Fatigue Characteristics of Sn-Based Solder Joints
Low-cycle, lap-shear fatigue behavior of Sn-based, Pb-free solder alloys, Sn3.5Ag, Sn-3.5Ag-Cu, Sn-3.5Ag-Bi, and Sn-0.7Cu, were studied at room temperature using specimens with printed circuit board (PCB)/solder/PCB structure under total displacement of ±10 μm, 12 μm, 15 μm, and 20 μm. The fatigue lives of various solder joint materials, defined as 50% load drop, were correlated with the fractu...
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The effect of electroplated Cu (EPC), electroplated Sn (EPS) and Cu addition (0.7 wt.%) on the void formation at the reaction interfacewas investigated through the reaction of solderswithCu substrates. The voidswere observed at the Cu3Sn/EPC interface in the Sn/EPC joints after aging at 150 C, while not at the Cu3Sn/high purity Cu (HPC) interface in the Sn/HPC joints even after aging at 180 C f...
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The reliability of Pb-free solder joints is controlled by their microstructural constituents. Therefore, knowledge of the solder microconstituents' mechanical properties as a function of temperature is required. Sn-Ag-Cu lead-free solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) CueSn5 and Ag3Sn. Typically, the Sn-rich phase is surrounded by a eutectic...
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ژورنال
عنوان ژورنال: Jixie gongcheng xuebao
سال: 2022
ISSN: ['0577-6686']
DOI: https://doi.org/10.3901/jme.2022.02.236